Semiconductor industry is Agileo Automation's historical domain of expertise.
A wide variety of equipment
We have experience controlling and connecting through SECS/GEM and GEM300 multiple Front-end, Advanced Packaging and Back-end equipment types:
Process
- Atomic Layer Deposition (ALD)
- Chemical Mechanical Polishing (CMP)
- Ion implanter
- Laser annealing tools
- Molecular-Beam Epitaxy (MBE)
- Oxidation furnaces
- Plasma cleaning and etchers with Inductive Coupled Plasma (ICP), Bosch Process
- Plasma Immersion Implantation
- Pulsed Laser Deposition (PLD)
- Physical Vapor Deposition (PVD)
- Die attach systems
- Die bonders
- Flip-chip bonders
Automation Handling
- Bare Wafer stockers
- Furnace loaders
- Reticle sorters
- Semi-bare Reticle stockers
- Wafer sorters
- Cluster tools with atmospheric and vacuum robots
Metrology Test
- Automatic Test Equipment (ATE)
- In-situ metrology for process control
- Optical Metrology for CD and overlay registration
- Panel Metrology tools
- Panel Inspection tools
- Wafer 3D Inspection
Many Substrates and Carriers
We have worked with all these substrates and carriers:
- Wafer sizes from a few square millimeters for laboratories to 450mm including 150mm (6"), 200mm (8") and 300mm (12")
- Panels for Panel-Level Packaging (PLP), including 310x310 mm panels, with the capability to manage larger substrates
- Thin wafers, Taiko wafers, Wafers on wafer carrier
- Glass substrates
- Wafer frames
- End effectors: Edge contact, Vacuum, Bernoulli optionally with Flip capability
- Wafer carriers: FOUP, FFO, Open cassette, SMIF pods
Fabs all over the world
We have commissioned tools all over the world and we know the specific requirements of fabs (names are not disclosed for confidentiality sake):
Americas
- Idaho, USA
- Florida, USA
- New York, USA
- Massachusetts, USA
- Canada
Europe
- Austria
- France
- Germany
- Italy
- United Kingdom
- Switzerland
Asia
- China
- Malaysia
- Singapore
- South Korea
- Taiwan
- Japan
Dedicated products
Agileo Automation has capitalized on its diversified experience to develop software products that enable semiconductor OEMs to:
- Be in the right "time to market"
- Reduce their software development effort
- Focus on their core business
We propose field-proven products for the semiconductor industry:
- A²ECF Semi: a software framework controlling complex tools ranging from standalone process modules to complex cluster tools with multiple process modules and robotics. It also provides SECS/GEM or GEM300 connectivity.
- Agil'GEM: a SECS/GEM library to connect equipment to the Fab IT system (Host/MES/EAP)
- Agil'GEM300: .NET/C# library to make a tool compliant with GEM300 connectivity
- Agil'EDA implements the complete Freeze 2 standard set (SEMI E120, E125, E132, E134, E164), making it fully compatible with EDA requirements across all semiconductor manufacturing steps.
- Speech Scenario: a Host or Equipment emulator to validate communication before delivery, supporting E4 SECS-I, E37 HSMS-SS, E5 SECS-II, and E173 SECS-II Message Notation.
- Agil'Sorter: an application based on A²ECF Semi to control wafer sorter tools
- Agil'SECS-II: a software that enables to connect Host (also known as MES or EAP) systems and production equipment using common protocols such as SECS/GEM or GEM300.
- E84 PIO BOX: an interface between Speech Scenario and E84 passive equipment used to test automatic carrier delivery on a semiconductor tool.
SEMI Standards Supported by Agileo Products
Fabs require compliance across a broad set of SEMI standards. Each standard addresses a different functional area. Agileo Automation addresses all of these areas across its product portfolio:
| FUNCTION | STANDARD | PRODUCT ASSOCIATED |
|---|---|---|
| SECS/HSMS Communication & Core Automation | E4, E5, E30, E37 | Agil'GEM |
| Advanced Equipment Automation & Tracking | E39, E40, E84, E87, E90, E94, E116, E148, E157, E172, E173 inclut également les normes prises en charge par Agil'GEM | Agil'GEM300 |
| Equipment Data Acquisition (EDA / Interface A) | E120, E125, E132, E134, E164 | Agil'EDA |
| Carrier Handoff & Management | E84, E87 | E84 PIO Box |
SEMI Contribution
Supporting the semiconductor industry requires a clear commitment to standard evolution. As a SEMI member, we are actively involved in this process. Our team recently joined the SEMI Headquarters in Milpitas, working with other participants to validate future standards.
