Research & Development

Preparing for the future

R&D is a major activity to prepare the future of our solutions. We develop this activity both internally, within the framework of collaborative projects and by participating in our customers' R&D projects.

This work allows us to enrich our product offer (A²ECF-SEMI, A²ECF-Industry,...) as well as our expertise.

Research areas

We are continuously developing our skills in our areas of expertise and preparing to meet the challenges of the future for our customers:


  • ​​​Industry 4.0
  • OPC UA
  • SEMI Standards
  • Digital Twins
  • Machine learning
  • Artificial Intelligence
  • MDE: Model Driven Engineering
  • Software Framework patterns
  • Advanced manufacturing or Closed-loop manufacturing


The challenges we face are :

  • Interoperability
  • Green manufacturing
  • Performance optimization
  • Portability of solutions in varying industrial domains (standards, techniques) 
  • Workflow scheduling

R&D objectifs

Interoperability and standardization

We participate in numerous working groups for the standardization of exchanges between machines and computer systems in factories:

  • OPC UA within OPC Foundation
    • I4AAS working group
    • Machine Tools (UMATI) working group
    • UA for Machinery working group
    • Asset management working group (Co-editor)
    • Harmonization working group
    • OPC UA Core working group
  • Within SEMI
    • Contribution in the development of SEMI standards
    • GEM300 Task Force
    • Trainings on the SEMI Standards

Collaborative projects

  • OTPaaS from 2021 to 2024
    • Platform as a Service (PaaS) to ensure digital continuity between the field and the cloud.
    • Work on high volume and high speed data collection for semiconductor fabs as well as on semiconductor equipment extension with data contextualization.
    • Work in partnership notably with CEA-LETI end CEA-LIST. 
  • Productive 4.0 from 2017 to 2020
    • Worked on the assessment of OPC UA for semiconductor domain
    • ESCEL-JU Project H2020
    • Proof of concepts & demos prepared for the project
    • Publications in IEEE Conferences
  • OEDIPUS in 2017
    • Developed an OPC UA gateway for a collaborative robot that could communicate in Modbus. Solution integrated with Siemens MindSphere.
    • EIT Digital project

We collaborate with many partners

Scientific publications

We regularly publish articles in international conferences about our work:

Agileo automation

Accept cookies

This site uses cookies to compile anonymous site visit statistics. Accept cookies ?

More information... Refuse More information...